Automatic feeding mechanism



United States Patent Martin G. Heller 78 Warren Road, West Orange, NJ. 07052 Appl. No. 769,109

Filed Oct. 21, 1968 Patented Dec. 22, 1970 Inventor AUTOMATIC FEEDING MECHANISM 21 Claims, 11 Drawing Figs.

U.S. Cl. 198/24 lnt. (I 865g 47/00 Field of Search 198/24, 19; 140/1; 209/75, 85

References Cited UNITED STATES PATENTS 3,115,964 12/1963 Logan Primary Examiner-Richard E. Aegerter Attorney-Ralph R. Roberts .PATENTED DEC22I970 I 7 3548598 SHEET 1 OF 3 mvrzmon MART/N 6. HELLER AGENT.

PATENIEgnmezmm SHEET 2 BF 3 3549,9953

mvsmon MART/N 6. HEL LEI? A aE/vr.

PATENTEU UEB22 I971} SHEET 3 OF 3 INVENTOR.

MART/N 6. HELLER 1 AUTOMATIC FEEDING MECHANISM BACKGROUND or THE INVENTION 1. Field of the Invention The field of art to which this invention pertains is the general class of wireworking and in particular to the subclass wherein there is combined machines. The art may also pertain to the class of classifying, separating, and assorting solids and the subclass of automatic assorting.

2. Description of the Prior Art v v The rapidly expandingland extensive use of the transistor in the many every day electrical apparatus as well as computers and the like has brought equipment forthe' automatic cutting and bending of the several leads of the transistors imo widespread use. In particular, the processing of transistor leads by apparatus such as that shown and claimed in U.S. Pat. No. 3,396,758 to R.L. Hall issued Aug; '13, 1968 has been quite successful. Apparatus according to'the Hall patent is now used by many companies to daily process many thousands of like transistors. However, the apparatus of the Hall Pat. is adapted for a hand feeding of the transistors to a sloped feeding chute. This hand feeding limits the production of processed transistors of the manual dexterity-and effort of the operator, which rate or speed is often less than satisfactory.

Other electrical component processing apparatus such as that shown in U.S. Pat. NO. 3,236,374 to Zimmerman issued Feb. 22, I966; as in U.S.-Pat. No. 3,276,58010 Horn et al. issued Oct. 4, I966; U.S. Pat. No. 2,961,027 to Ullman et al. issued Nov. 22, I960, and U.S. Pat. No. 3,032,191 to Clukey et al. issued May 1, I962 use hand loading techniques for their source of supply. r

In the present invention an automatic loading apparatus eliminates the necessity of hand loading and increases the productionby. about five times. For example, with hand loading, an average operator of the apparatus ofthe Hall Pat. is expected to feed about one thousand oriented transistors per hour to the chute. With the automatic feeding mechanism of this invention, a feed rate of 5,000tran'sistors per hour has been produced as an actual reduction topractice.

SUMMARY OF THE INVENTION 7 In the automatic feeding mechanism of this invention, transistors in an oriented array are fed one at a time to a gravity'discharge chute. At the lower end of this discharge chute a receiving die is cycled from in way of the. end of the chute to a transfer position at a receiving pocketin a transport wheel of the transistor lead processing apparatus of the Hall Pat. The receiving die is reciprocated between a-receiving limit or position and a discharge limit or transfer position of movement. The cycling action of the die is provided by a crank arm driven adjustable connecting arm attached to a header block. The header block engages opposed compression'springs which also engage a cycling frame which removably carries the die. The length of the connectingarm is adjusted to lengthen or shorten the dwell times at the ends of the cycling stroke.

It is an object of this invention to provide an automatic feeding mechanism for transistors, in which mechanism there is provided a receiving die adapted to receive oriented like-sized transistors from a delivery chuteand one, at a time deliver these oriented transistors to a receiving pocket in a transport wheel of a transistor lead processing apparatus.

It is a further object of this invention to provide an automatic feeding mechanism for transistors wherein a receiving die is carried by a frame member reciprocated in response to the movement of. a connecting arm of adjustable length. This INTENT OF THE DISCLOSURE Although the following disclosure offered for public dissemination is detailed to insure adequacy .and aid in the understanding of the invention, this is not intended to prejudice that purpose of a patent which is to cover each inventive concept therein no matter how it may later be disguised by variations in form or additions. The claims at the end hereof are intended as the chief aid toward this purpose, as it is these that meet the requirement of pointing out theparts, improvements, combinations or methods in which the inventive concepts are found.

There has been chosen a specific embodiment of the automatic feeding mechanism for transferring oriented transistors from a chute to a transistor lead processing apparatus and for synchronized use therewith. The embodiment includes a preferred means for feeding the transistors in an oriented manner to a gravity chute. This specific embodiment has been chosen for the purpose of illustration and description as shown in the accompanying drawings whereim BRIEF DESCRIPTION or THEDRAWINGS FIG. 1 represents a side view of a supply hopper and an automatic feeding mechanism for use. with a processing apparatus for bending and trimming the-leads of a transistor;

FIG. 2 represents a partially diagrammatic side view showing a portion of the internal arrangement of the transistor feeding mechanism with the transistor transferring apparatus disposed in one limit position of operation;

FIG. 3 represents a fragmentary plan view of the cycling apparatus of FIG. 2, the view being taken on the line 3-3 of FIG. 2 and looking in the direction of the arrows;

FIG. 4 represents the cycling frame of the apparatus of FIG. 2 wherein the connecting arm has been moved to a different orientation of the cycling stroke;

FIG. 5 represents the cycling frameof FIG. 4 wherein the connecting arm has now been moved to it's forwardmost position of cycling stroke;

FIG. 6 represents a side view of a transistor receiving die disposed for use with the cycling mechanism of FIG. 2;

FIG. 7 represents a top or plan view of the receiving die of FIG. 6, the view taken on the line 7-7 of FIG. 6 and looking in the direction of the arrows;

FIG. 8 represents a side view of the other side of the receiving die of FIG. 6, the view taken on the line 8-8 of FIG. 7;

' representation of the transistor feeding mechanism and showframe member is immediately engaged by compression springs ing in particular the receiving wheel of the transistor processing apparatus and the disposition of a feeding chute to the receiving die of FIGS. b, 7 and 8; and

FIG. 11 represents atcross-sectional view of the transistor transfer chute of FIG. 9, the view taken being on the line 11-11 ofFIG. l0.

In the following description and in the claims, various details will be identified by specific names for convenience; these names, however, are intended to'be generic in their application. Corresponding reference characters refer to like members throughout the several FIGS. of the drawings.

BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENT 1 Referring now in particular to the assembly of FIG. I, it is to be noted that the apparatus for the processing of transistor leads is generally indicated as 15. This apparatus is shown and described in particular in U.S. Pat. No. 3,396,758 issued to R. L. Hall on Aug. 13, I968. In the apparatus and method as disclosed in said U.S. patent the transistors for processing are oriented and fed one by one to the transfer wheel by means of a finger chute. These transistors are oriented and fed by hand to the wheel. The structure and method of the lead processing apparatus of US. Pat. No 3,396,758 is incorporated by reference into the present specification. In particular, the preferred embodiment of this invention is directed to automating the feeding of oriented transistors to the transfer wheel shown in this patent.

In the general arrangement of FIG., 1 and to the left of the apparatus generally indicated as 15, there is provided a pipe stand 20 upon which is mounted a vibratory feeder unit 22. This feeder unit carries an orienting and storage bowl 24 of special design and adapted to align and feed transistors having their leads extending from one side. From this bowl, a continuous supply of transistors'26 are fed by means of a chute 28 to the transistor lead processing apparatus 15. Although only one bowl and vibratory feeder apparatus is shown, it is'contemplated that two such feeders and chutes may be used to provide the transistor lead processing apparatus with a dual supplywhen said apparatus is adapted to process a pair of transistors at one and the same time. As the transistors are of various 'sizes, the vibratory feeders, chutes and associated components are assembled so as to orient and feed from a large supply of like-sized transistors a stream of transistors to the feeding mechanism to be more fully described hereinafter.

The vibratory feeder assembly and associated chute are only indicative of one means of supplying'oriented transistors to the processing apparatus within housing however, whether supplied from a bowl feeder or supplied from a vertical prefilled delivery chute to be hereinafter more fully described, it is contemplated that the delivery of the transistors to thefeeding mechanism be by gravity and in a vertical manner. In particular, a removable preloaded chute or delivery guideway 30 is shown to the right of the chute 28. This removable chute provides a method whereby oriented transistors are pregrouped for feeding to the lead processing apparatus. These prefilled chutes are usually of a size and capacity to retain orientated groupings of two hundred or more transistors.

Referring next to FIGS. 2 and 3, there is shown the automatic feeding mechanism and means for transferring transistors one at a time into a feeding or transfer wheel of the transistor lead processing apparatus 15. As seen in particular in FIG. 2, power to operate the feeding mechanism is derived from the lead processing apparatus. On one of the powered shafts of the processing apparatus, which shaft is identified as the driver or power shaft 34, there is mounted a timing belt pulley 36 which drives a timing belt 38. This belt-extends to and rotates a timing belt pulley, not shown, and which is mounted on and drives a' driven shaft 40. This belt 38 is preferably positioned to the outside of theapparatus so as to provide ready access for repair and places the drive out of the way of the feeding mechanism. A spur gear 42 is carried on shaft 40. and this gear meshes and, as it is rotated, turns a likesized spur gear 44 carried on and driving a shaft 46. A hub member 47 is mounted on the near end of shaft 46 and carries a crankpin .48 which retains one end of an antifriction rod end 50. Gear 44 also carries a like crankpin 48 which is aligned with the near crank pin 48. As shaft 46 is rotated, both crankpins are moved simultaneously with their axis in coincidence.

Rod end 50 has its threaded end mounted on a threaded shaft or stud 52. Lock nuts 54 and 55 are also carried on this shaft 52. The left end of shaft 52 has mounted thereon an antifriction rod end 56. The combination of members comprising the rod ends 50 and 56 shaft 52 and nuts 54 and 55 provide a connecting rod assembly which is adjustable in length for a purposeto be hereinaftermore fully described. As seen in FIG. 3, this connecting rod assembly is disposed at the bottom of the view. A like connecting rod assembly is also shown in the upper portion of the FIG. 3 and on the opposite side of support plate 58 .This upper or opposite connecting rod assembly includes antifriction rod ends 60 and 62 mounted on and carried by threaded shaft or stud 64. Nuts 54 and 55 act as lock nuts to retain shaft 64 in position in the rod ends.

As seen in FIGS. 2 and 3, the crankpins have their axis spaced a determined distance from the axis of shaft 46 whereby. As shaft 40 is rotated, gear 42 causes gear 44 to turn so that the pins 48, as carried by gear 44 and hub 47, are carried in a circular path as well as the rod ends 50 and 60 mounted on the respective pins 48. The rod ends 56 and 62 providing the other ends of the connecting rod assemblies are mounted on shouldered capscrews 66 and 68 which are removably mounted in header blocks 72 and 74. These blocks are substantially alike and are disposed'to carry the rod ends on the outwardly facing portions of the block. Each header block has a pair of spaced bores disposed to carry a pair of ball bushings therein. These header blocks, by means of the ball bushings, are reciprocably carried on shafts or rods 76, 77, 78 and 79. Header block 72 is carried on and is reciprocated on shafts 76 and 77 while header block 74 iscarried on and is reciprocated on shafts 78 and 79. The ends of these shafts or rods are mounted in'and are carried by support blocks 80, 81, 82 and 83.

On each side of the header block and mounted partly in the bushing holes in the block are shoulder retaining members 84. The outer diameters of these shoulder retaining members are sized to receive and retain one of the ends of like compression springs 86 and 87. These springs are disposed on each side of the header block and have their'other ends disposed so as to engage the end members of a die frame 88 or 89. Die frame 88 is the near frame and die frame 89 is the far frame. The springs 86 and 87. are alike in their length and compressive tension and in their installed condition are under a determined amount of compression As the header block is moved back and forth on the shafts toward and away from the support blocks, the springs 86 and 87 are alternately compressed 'or allowed to expand. It is to be noted that the forward support blocks and 82 are each provided, intermediate their ends, with cutouts ductouts 90 and 92 to permit the movement therethrough of a die to be described hereinafter.

CYCLING OF THE DIE FRAME response to the rotation of shaft 40 and the meshed gears 42 and 44, the header blocks 72 and 74 are moved for forwardly and backwardly on the rods. As either the spring 86 or 87 is compressed beyond its average compression, the other spring is relaxed'in tension, thereby allowing the frame to be moved by the tensioned spring. For example, as the header blocks 72 and 74 are moved to the left, each spring 86 is compressed and moves the engaged frame 88 or 89 leftwardly. On the reverse stroke or rightward movement of the blocks, the expanded springs 87 are compressed until their compression is greater than springs 86 whereupon the frames 88 and 89 are moved rightwards toward shaft 46. The use and advantage of this means for cycling of the die frame is more fully described in the use and operation of the complete automatic feeding mechanism described hereinafter.

TRANSISTOR TRANSPORTING DIE Referring next to FIGS. 6, 7 and 8, there is shown a transistor transporting die which is provided on its rear or mounting surface 111 with a pair of threaded holes 112 and 113. These threaded holes are for mounting of the die to the frame 88 by bolts not shown. The other end of the die is coiltoured and is provided with extending ear portions 114 and 11S constructed so as to provide a determined space therebetween. In the extending ear portion 115, there is provided a cutout pocket 117 which is sized to receive and retain the body of the transistor 26. The other extending ear portion 114 is formed with a notch 118 having entering chamfers disposed to act as guides for the leads of the transistor. FIG 8 shows, in phantom outline, the grouping of leads 120, 121 and 122 of the oriented transistor 26. The leads are disposed in the notch 118 with the leads 120 and 121 engaged and retained by a forward face 124 of the notch while. the third lead 122 is disposed to engage a back or rear face 125 of the notch. Relief 126 is provided inear 114 so as to reduce to a practical minimum thesupport surface of the notch 118. The less the surface of the notch and the closer to the body of the transistor, the less is there a possibility of a bent lead to affect the orientation and desired positioning of the transistor in the ear portions of the die. 7

Referring next to FIG. 9, there is shown afragmentary view of the transfer wheel. 129 of U.S. Pat. No..3,396,758 to Hall and in particular to the FIGS. 3, 4, 4A and 5 of the patent. In FIG. 9 of this application, the main disc 130 has. adjacent thereto a carrier disc 13Iwith spacedcut outs 132 therein. An outer lead retaining disc 133 has cutouts 134 formed therein for the shoulder of the transistor body. Groups of three notches are also provided indisc l33'to coincide with the disposition of the leads of the transistors. The extending ear. portions 114 and 115 are shown in phantom outline and are sized and spaced so that as the die is cycledtl'iey are caused to enter between the discs 130 and 1-31 and to the outside of disc 133. Although the disc 130 is shown as being a rotating member in the patent, it has been found that this disc can also be madeflnonrotating. The fixing of the disc reduces the flywheel effect of the transfer wheel assembly and permits a speedup of this mechanism. Whether nonrotating or rotating, the earllS enters between disc 130 and 131, and car 114 is brought outside and adjacent disc 132. l

Referring next to FIGS. and 11, there is shown the transport die 110 in attached condition to the front face of die frame 88 which is shown "in phantom outline'..A chute 140 includes a main back member 142 having a groove 143 formed therein. This groove is sized to receive and slidably guide the head or body of the transistors. Rightand left-hand cover members 145 and 146 are attached to the face of the back member and have their facing edges spaced and positioned so as to act as retaining guides for the oriented transistors 26 carried therein. The two leads 120 and 121'are slidably engaged by the right edge of cover member 145 and the third lead 122 is slidably engaged by the left edge ofcover member 146. The inner faces of the cover members slidably engage the head or forward movement of header block 74. The novel feeding mechanism as seen in FIGS. 2, 3, 4 andj5 utilizes this timed rotation of shaft 34 to precisely rotate shaft 40 and shah 46. As shaft 46 rotates, the orbital path of the crankpins 48 cause header blocks 72 and 74 to reciprocate. From the extreme rear condition of FIG. 2, the header block 72 is moved to the condition of FIG. 4 whereat spring 87 is allowed to expand to its substantially midlength mounted condition and spring86 from its expanded condition is beginning to be compressed to a condition in excess of that of spring87. In the condition of FIG. 5, the crankpin 48 is in its forwardmost' condition, and

the header block has been moved to its forwardmost condition. Spring 86 has been compressed and in so doing, its compressive condition becomes greater than that in spring 87.

Spring 86 thus urges die frame 88 forwardly until it engages and is stopped by support block 80. As the crank arm 48 is continued in its circular or orbital path,- spring 86 is allowed to expand although still compressed the leftwardly moving header 72. Spring 87 is compressed until the force in spring 87 is greater than that in spring 86, whereupon the compressed spring 87 moves die frame 72 rightwardly to the condition of FIG. 2 with the frame stopped against support block 81. Die frame 89 is also cycled in the same manner and in synchronism with frame 88.

In the operation of the feeding mechanism; a delay time is needed at each limit of movement of the the 110. These delay compression of springs 86 and 87 provides this determined body of the transistors. The cooperative'.operation of the chute and transport die is more fully described below.

USE AND OPERATION OF EXEMPLIFIED APPARATUS The automatic feeding mechanism isdisposedto receive a supply of transistors 26 from the feeder bowl 24 wherefrom they are fed to and through chute 28 until they are delivered to the chute 140. In an oriented condition, the transistors are fed by gravity through this chute to' the transport die 110 which is adapted to receive and retain a single transistor when the die is positioned as in FIG. 10. The single transistor 26 in the die 110 supports those transistors which are in the chute 140 above. The die member 1 10 is moved forwardly from the receiving position to carrythe transistor 26 to and into the pocket in the transfer wheel 129. This forward movement of the die is in timed relationship to the -movement of the wheel. This timed relationship is established and maintained by means of the timing belt system of FIG. 2. As it is moved into the pocket of the transfer wheel, the three leads of the oriented transistor enter the notches' I50, 1151 and 152 in the outer disc 133 of the wheel, and the body of the transistor enters the cutout 132' of the carrier disc 131'. As the transfer wheel 129 is moved in a counterclockwise direction, the transistor 26 is lifted from the die l10,.after which the die is moved back to the receiving position of FIG. '10.

Asdescribed in the referenced patent, the transfer wheel 129 is intermittently moved, and by meansof the timing belt system, so also is the die 110. The frame88 is cycled from the receiving condition of FIG. to the discharge position by the delay time. By adjusting the position of rod ends 50 and 66 on threaded shaft 52, the forward and rearward extremes of position of the header block is adjustedto the desired condition to provide a delay of determined duration. These delays provide time for the transistor 26 to drop into the die I10 and after moving the die to transfer the transistor into the pocket in the transfer wheel 129, a delay is provided so that the transistor may be lifted from the die. As the crank, arm moving the header is made longer, the delay time in which the die remains in the transfer wheel 129 is made longer. Conversely as the crank arm is made shorter, the time in which the die 110 remains in way of the chute is made longer.

The die 110, the chute 140 and the components of the transfer wheel 129 are all made readily removable so that like members designed to receive and process other size transistors may be substituted for other members. This procedure is necessary to accommodate transistors of difi'erent sizes and lead arrangements and positions. 'This'change in feeding mechanism components corresponds to the availability of changing the dies for fonning and trimming the leads as is proshown and described is for mounting on the die frame 88 while a die which is a mirror image is used en die frame 89 to trans-v port a second lot of transistors to the processing apparatus. of course, one transferring apparatus and die is needed for each processing line of the apparatus of the reference patent. When 65 desired, two lines of transistors are simultaneously automatically fed and processed.

In the exemplified embodiment thetransport die 110 is constructed so that the upper surface of its shank portion is brought in way of the next above transistoras the die "5 in its transport cycle. It is also recognized that a spring-loaded member can be carried by and actuated by the movement of die frame 88 so as to engage and retain. the next above transistor in the chute 140 as the die'is cycled. Electromagnetic and pneumatic actuated devices could also be used as a transistor holding device for those transistors in the chute I40.

Terms such as left," right, up, down," bottom, top," front," back," in," out, clockwise counterclockwise and the like and applicable to the embodiment shown and described in conjunction with the drawings. These terms are merely for the purposes of description and do not necessarily apply to the position in which the automatic transistor transferring apparatus is constructed or used.

The conception of this transferring apparatus is not limited to the specific embodiment shown but departures therefrom may be made within the scope of the accompanying claims and advantages and protection is sought to the broadest extent the prior art allows.

Iclaim: I

1. An automatic feeding mechanism for transferring oriented transistors, each having a plurality of leads, the transistor, as it is automatically fed by the mechanism, is moved from a receiving position to a transport mechanism of a transistor processing apparatus, the feeding mechanism including: (a) means for feeding an oriented array of transistors to and through a chute; (b) a transport die adapted to receive one of the transistors from the chute, said die having a pair of extending ear portions contoured to provide a determined space between the ears, one ear having a pocket with upwardly extending sides disposed to guide the body of the transistor into the pocket which is sized so as to receive and retain the body of the transistor, and the other ear is formed with a notch having sides spaced so that one side is disposed to slidably engage at least one of the leads of the oriented transistor while the other side of the notch slidably engages at least two of the leads of the transistor; and (c) means for moving the transport die from a loading position in way of the chute to a transport mechanism having turn transistor receiving means, whereat the transistor in the die is moved into the transistor retaining means of the transport mechanism.

2. An automatic feeding mechanism for transferring oriented transistors as in claim 1 in which the ear portions of the transport die are sized and cycled so that a first ear enters between a main disc and a carrier disc of the transport mechanism and the other ear is spaced from said first ear so that with the first ear between the main and carrier discs the second ear is outside and adjacent a lead retaining disc of the transport mechanism.

'3. An automatic feeding mechanism for transferring oriented transistors as in claim 2 in which the second ear is provided with a relief adjacent the notch so as to reduce the surface of the notch in engagement with the leads of the transistor.

4. An automatic feeding mechanism for transferring oriented transistors as in claim 1 in which the means for moving the transport die is a cycling mechanism disposed to be reciprocably moved with a linear motion, the cycling mechanism having means for providing a time delay at each end of the linear motion. 1

5. An automatic feeding mechanism for transferring oriented transistors as in claim 4 in which the cycling mechanism is moved by a connecting arm having one end carried and driven by an eccentrically moved crankpin and with the other end of the connecting arm attached to a header block carried on a linear guide means, the header block adapted to move a die support member disposed to removably retain the transport die.

6. An automatic feeding mechanism for transferring oriented transistors as in claim 5 in which the linear guide means includes a pair of parallel rods carried in retainers positioned on a support plate, the header block is also carried on these rods; and in which the die support member is a die frame movable to-and-fro on these same rods and to selected positions and limits.

7. An automatic feeding mechanism for transferring oriented transistors as in claim 6 in which the means for providing a time delay is at least one resilient member disposed on each side of the header block and to be moved by the header block to in turn cause the die frame to be moved to a stop whereupon the header block continues to move and additional distance toward and away from the die frame, the time necessary for the header block to travel this additional distance providing a determined time delay.

8. An automatic feeding mechanism for transferring oriented transistors as in claim 7 in which the connecting arm is made adjustable in length so that the time delays provided at the ends of the stroke of the header block may be increased and decreased in accordance with a said adjustment.

9. An automatic feeding mechanism for transferring oriented transistors, each of which has a plurality of leads, the transitor, as it is automatically fed by the mechanism, is moved from a receiving position to a discharge position at a transport mechanism of a transistor processing apparatus, the automatic feeding mechanism including: (a) means for feeding an oriented array of transistors to and through an orienting guide means; (b) an transport die adapted to receive and retain an oriented transistor from the orienting guide means; (c) a transistor transport mechanism having a sequence of transistor receiving means, each adapted to receive at least one transistor; (d) a reciprocating member disposed to carry the transport die in a linear stroke pattern from in way of the guide means to the transport mechanism and back to the guide means; (e) a power transmitting drive means for providing a synchronism of movement between and extending from the transistor transport mechanism to means for moving the reciprocating member; and (f) means for providing a delay time of the transport die at each end of the linear stroke.

10. An automatic feeding mechanism for transferring oriented transistors as in claim 9 in which there is provided a chute adapted to receive a supply of transistors in a single file array and to deliver them to a discharge position above the transport die and in which the reciprocating member is a die frame carried on a linear slide means with a time delay provided at each end of the reciprocation.

11. An automatic feeding mechanism for transferring oriented transistors as in claim 10 in which the linear slide means includes a pair of parallel rods carried in retainers positioned on a support plate, the die frame and a header block disposed to engage and move said die frame, the block and die frame both slidably carried on the parallel rods.

12. An automatic feeding mechanism for transferring oriented transistors as in claim 11 in which the power-transmitting means includes a driven shaft and a crankpin eccentrically carried thereon, a connecting arm extending from the crankpin to the header block and resilient means on each side of the header block and disposed to engage the die frame to move the die frame and to provide overtravel of the header block for the time delay of the transport die.

13. An automatic feeding mechanism for transferring oriented transistors as in claim 12 in which the connecting arm is made adjustable in length so that the time delays provided by the overtravel of the header block may motion increased in accordance with said adjustment.

14. An automatic feeding mechanism for transferring oriented transistors as in claim 13 in which the resilient means is a compression spring and in which the retainers for the parallel rods provide positive limits for the to-and-fro motion of the die frame on the rods.

15. An automatic feeding mechanism for transferring oriented transistors as in claim 9 in which there is provided means for engaging and supporting the next above transistor in the chute as the transport die is cycled from the guide means to the transport mechanism and back to the guide means.

16. An automatic feeding mechanism for transferring oriented transistors as in claim 15 in which the means for engaging and supporting the next above transistor is a body portion of the transport die sized to engage and slide beneath the next above transistor.

17. The method of automatically feeding and transferring oriented transistors from a delivery chute to a transport mechanism of a transistor processing apparatus, the method including the steps of of: (a) feeding an oriented array of axis of the transistor is disposed in a substantially horizontal condition; positioning an open-topped pocket of a transport die in way of the discharge end of said chute; (d) receiving an oriented transistor in said pocket of the transport die; (e) moving the transport die from'in way of the chute to a transport mechanism of a transistor processing apparatus; (f) seating the transistor in a retaining notch in the transport mechanism; (g) advancing the transport mechanism so as to lift upwardly the transistor from the pocket of the transport die; and (h) returning the transport die toposition the opentopped pocket in way of the discharge end of the chute.

18. The method of automatically fed feeding and transferring oriented transistors as in claim 17in which there is pro-. vided the additional step of restrainingany cycling movement of the transport die during the period of advancing movement of the transport mechanism necessary to left upwardly the transistor from the open-topped pocket of the transport die.

19. The method of automatically feeding and transferring oriented transistors as in claim 18 in which there is provided the additional step of engaging the transistor next above the transistor in the open-topped pocket of the transport die during that period of time the pocket is-not in way of the end of 20. The method of automatically feeding and transferring oriented transistors as in claim 18 in which there is provided the additional step of moving a support upper surface of the transport die in way of the end of the chute during the period of time the open-topped pocket of the die is not in way of the end of the chute. i

21. The method of automatically feeding and transferring oriented transistors as in claim 17 in which the moving of the transport die includes the step of retaining the open-topped pocket of the transport die in way of the chute for a determined extent of time necessary forthe transistor to fall from the chute into the open-topped pocket.

z gz g UNITED STATES PATENT OFFICE CERTIFICATE OF CORRECTION Patent No. 3,5 ,99 Dated December 22nd, 1970 Inventory Martin G. Heller It is certified that error appears in the above-identified patent and that said Letters Patent are hereby corrected as shown below:

I Col.

1, line 6, first occurrence, should read to 1, line 29, "NO." should be No.

1, line 39, "Pat." should be Patent 1, line 52, "Pat." should be Patent Col. line 56, "b" should be --6--;

Col. line 60, "crank pin" should be --crankpin--;

Col. line 3, period should be a comma, and "As" should b line 31, period after "compression";

, line 36, "ductouts" should be deleted;

, line 47, "for" should be deleted;

Col.

u, u, L4.

Col. 5, line 75, after FIG." insert lO Col. line 3, "and" second occurrence should be are Col. line 32, "turn" should be deleted; Col. line 75, "and" should be an Col. line 8, "a" should be deleted;

, line 16, "an" first occurrence should be a line 53, "motion" should be be and after "increased" should be inserted and decr Col. 9, line 1 1', delete "fed"; Col. 9, line 18, "left" should read lift--;

Signed and sealed this 20th day of April 1971.

(SEAL) Attest:

EDWARD M. FLETCIIER,JR. WILLIAM E. SCHUYLER, JR. Attesting Officer Commissioner of Patents 

